ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
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United States of America
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Issued Date -
Dec 26, 2024
app pub date -
Jun 25, 2023
filing date -
Jun 25, 2023
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Abstract
In one example, an electronic device includes a substrate including a substrate outer side, a substrate inner side, a dielectric structure, and a conductive structure. An electronic component includes an upper side, a lower side opposite to the upper side and coupled to the substrate inner side; a lateral side connecting the upper side to the lower side; and a conductor on the upper side. A cover structure includes sidewalls coupled to the substrate inner side and an upper wall coupled to the sidewalls and comprising an inner side spaced apart from the conductor. A thermal interface material (TIM) contacts and is interposed between the conductor and the inner side of the upper wall. The TIM covers the conductor and the lateral side of the electronic component. Other examples and related methods are also disclosed herein.
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