PHOTOSENSITIVE RESIN AND PHOTORESIST COMPOSITION CONTAINING THE SAME

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United States of America

APP PUB NO 20240427245A1
SERIAL NO

18821318

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Abstract

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The present invention relates to a photosensitive resin that has high solubility in and good etching resistance to a developer even under sub-248 nm and 193 nm short-wavelength exposure sources and forms a low line edge roughness. The present invention also relates to a photoresist composition including the photosensitive resin.

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Patent Owner(s)

Patent OwnerAddress
TAKOMA TECHNOLOGY CO LTD1168 NONSANPYEONGYA-RO NOSEONG-MYEON CHUNGCHEONGNAM-DO NONSAN-SI 32903

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Park, Jin Kyu Sejong-si, KR 38 228
Ryu, Mi Sun Daejeon, KR 4 9

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