HEAT TREATMENT APPARATUS AND ACCURATE TEMPERATURE MEASUREMENT METHOD FOR SEMICONDUCTOR WORKPIECE
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
N/A
Issued Date -
Dec 26, 2024
app pub date -
Jun 3, 2024
filing date -
Jun 3, 2024
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A heat treatment apparatus is provided, which includes: a reaction chamber defined by an upper cover plate, a lower cover plate and a reaction chamber body; an infrared emitter located at an end of the upper cover plate; an infrared reflection sensor located at another end of the upper cover plate, and an infrared transmission sensor located at another end of the lower cover plate. The infrared emitter and the infrared reflection sensor are located at a side of the upper cover plate facing to the reaction chamber, the infrared transmission sensor is located at a side of the lower cover plate facing to the reaction chamber, the infrared emitter is located on a sidewall of an end of the reaction chamber body, and the infrared reflection sensor and the infrared transmission sensor are located on a sidewall of another end of the reaction chamber body.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully