PROCESS TEMPERATURE SENSOR WITH IMPROVED THERMAL ISOLATION
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United States of America
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Issued Date -
Dec 26, 2024
app pub date -
Jun 21, 2023
filing date -
Jun 21, 2023
priority date (Note) -
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status (Latency Note)
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Abstract
A temperature sensor assembly includes a temperature sensor body having a bore defined therein. The bore has a first internal surface feature and a second internal surface feature. A cap is disposed within the bore of the temperature sensor body proximate an end of the temperature sensor body. A temperature sensitive element is disposed within the cap. A first elastomeric ring is disposed about the cap and configured to interact with the first internal surface feature of the temperature sensor body. A second elastomeric ring is disposed about the cap and spaced from the first elastomeric ring. The second elastomeric ring is configured to interact with the second internal surface feature of the temperature sensor body. A wireless field device including the temperature sensor assembly is also provided.
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