THERMAL BREAK BETWEEN A SUBSTRATE PROCESSING CHAMBER AND SUBSTRATE HANDLING CHAMBER
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United States of America
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Issued Date -
Dec 26, 2024
app pub date -
Jun 17, 2024
filing date -
Jun 17, 2024
priority date (Note) -
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Abstract
Thermal breaks and/or gaps between portions of interfacing surfaces of two chambers reduce heat transfer between the chambers. An interface surface (e.g., of a gate valve) includes (i) a base surface; (ii) a raised ring surface extending outward beyond the base surface, wherein the raised ring surface extends around a gate valve access opening; (iii) a seal support surface extending around the raised ring surface; and (iv) at least one raised boss surface extending outward beyond the base surface. The interface surface defines an outer perimeter having a total interface area. The raised ring surface and raised boss surface(s) define at least a portion of a total contacting surface area of the interface surface that is spaced outward from the base surface. The total contacting surface area of the interface surface is less than 10% of the total interface area and/or less than 10% of the base surface's surface area.
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