DEPOSITION SYSTEM WITH INTEGRATED CARRIER CLEANING MODULES
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United States of America
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Issued Date -
Dec 26, 2024
app pub date -
Sep 4, 2024
filing date -
Sep 4, 2024
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Abstract
A method of cleaning wafer carriers includes the steps of: 1) loading a wafer carrier in need of cleaning into a cleaning chamber, injecting one or more cleaning gases into the cleaning chamber; 2) activating the one or more cleaning gases at a temperature ranging from about 400° C. to about 1000° C. under a pressure ranging from about 100 Torr to about 760 Torr; 3) exposing surfaces of the wafer carrier to the activated one or more cleaning gases; and 4) inspecting the wafer carrier surfaces using one or more surface characterization tools to determine if the wafer carrier has been cleaned.
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