DIE STACKING WITH CONTROLLED ANGULAR ALIGNMENT
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United States of America
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Issued Date -
Dec 26, 2024
app pub date -
Jun 20, 2023
filing date -
Jun 20, 2023
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Abstract
An alignment recess formed in a cover substrate such as a cover for a MEMS device allows a second substrate to be bonded to the cover substrate. The alignment recess is larger than the second substrate and has two corner regions diagonally opposite each other where a wall of the recess protrudes to form a notch. The notch is dimensioned such that when the second substrate is disposed within the recess with two opposing corners surrounded by respective notches of the recess, the angular position of the second substrate relative to the cover substrate can be controlled to within a desired amount of rotation.
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