DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT
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United States of America
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Issued Date -
Dec 26, 2024
app pub date -
Jun 20, 2023
filing date -
Jun 20, 2023
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Abstract
Alignment features formed on a cover substrate allow for a second substrate to be bonded to the cover substrate while ensuring that the second substrate is not titled with respect to a plane defined by the alignment features. Die attachment material is patterned such that it deforms or flows underneath the second substrate while allowing corners of the second substrate to rest on landing areas that are elevated above the top surface of the cover substrate. Some of the landing areas may include additional features that are elevated above the landing areas to form notches which constrain the rotational position of the second in addition to its tilt.
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