COMBINED SOUND TRANSDUCER AND PRESSURE SENSOR PACKAGE
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United States of America
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Issued Date -
Dec 26, 2024
app pub date -
Jun 3, 2024
filing date -
Jun 3, 2024
priority date (Note) -
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Abstract
A package includes a substrate having a first surface and an opposing second surface, a first cavity adjacent to the first surface of the substrate within the package, and a second cavity adjacent to the second surface of the substrate within the package, wherein the second cavity includes a fluid opening for allowing a fluid to enter the second cavity; a through hole in the substrate providing fluid communication between the first and second cavities; a MEMS sound transducer disposed in one of the first cavity or the second cavity; a MEMS pressure sensor disposed in the other one of the first cavity or the second cavity; and a discrete transfer block arranged on the substrate and configured to provide an electric path between the package pad and the MEMS sound transducer and the MEMS pressure sensor, wherein the transfer block is a discrete component separate from the substrate.
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