HIGH FREQUENCY ULTRASONIC TRANSDUCER AND METHOD OF FABRICATION
Number of patents in Portfolio can not be more than 2000
United States of America
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N/A
Issued Date -
Dec 26, 2024
app pub date -
Sep 6, 2024
filing date -
Sep 6, 2024
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A method of producing an ultrasonic transducer includes providing a delay line substrate, providing a piezoelectric substrate as a transducer element, depositing a metal conductive layer on one of the delay line substrate and the piezoelectric substrate, forming an atomic diffusion bond between the metal conductive layer and one of the delay line substrate and the piezoelectric substrate, patterning removal of a portion of the piezoelectric substrate to expose the metal conductive layer, depositing a first patterned electrode on the exposed metal conductive layer to allow external electrical connection to the exposed metal conductive layer, and depositing a second patterned electrode on the piezoelectric substrate to form an active area of the ultrasonic transducer and to allow external electrical connection to be made.
First Claim
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