HEAT HARVESTING IN DATA STORAGE DEVICES
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United States of America
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Issued Date -
Dec 19, 2024
app pub date -
Aug 14, 2023
filing date -
Aug 14, 2023
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Abstract
A data storage device includes TE elements thermally connected between IC chips thereof and a lid assembly. An electronic controller of the data storage device is configured to receive voltages generated by the TE elements in response to the heat generated in the IC chips and is further configured to use the voltages to provide electrical power to an electrical fan of the lid assembly. The fan generates an airflow for keeping the lid assembly at approximately ambient temperature, thereby facilitating heat removal from the IC chips by way of the TE elements.
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