SUBSTRATE PROCESSING EQUIPMENT AND METHOD OF DRIVING SUBSTRATE PROCESSING EQUIPMENT
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
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N/A
Issued Date -
Dec 19, 2024
app pub date -
Feb 20, 2024
filing date -
Feb 20, 2024
priority date (Note) -
Published
status (Latency Note)
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Importance

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Abstract
Disclosed are a substrate processing equipment and a method of driving the substrate processing equipment, which automatically cut off power supplied to a main circuit breaker and a branch circuit breaker when an operator inspects a process chamber or a power supply system. The substrate processing equipment for processing a substrate includes: a process processing module including loads utilized in a process for processing a substrate; a branch circuit breaker installed on a periphery to the process processing module and electrically connected to the loads; a main circuit breaker electrically connected to the branch circuit breaker and supplying power to the branch circuit breaker; and a power distribution board in which the branch circuit breaker is mounted, and including a power distribution board door, in which the main circuit breaker cuts off power when the power distribution board door is opened.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SEMES CO LTD | 77 4SANDAN 5-GIL JIKSAN-EUP SEOBUK-GU CHEONAN-SI CHUNGCHEONGNAM-DO 31040 |
International Classification(s)

- 2024 Application Filing Year
- H01L Class
- 12855 Applications Filed
- 458 Patents Issued To-Date
- 3.57 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
KIM, Jae Min | Gunpo-si, KR | 105 | 581 |
# of filed Patents : 105 Total Citations : 581 | |||
LEE, Gun Min | Hongseong, KR | 3 | 3 |
# of filed Patents : 3 Total Citations : 3 |
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Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 1 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Jun 19, 2028 |
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jun 19, 2032 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jun 19, 2036 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 3.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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