SEMICONDUCTOR DEVICE
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United States of America
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Issued Date -
Dec 19, 2024
app pub date -
Jun 14, 2024
filing date -
Jun 14, 2024
priority date (Note) -
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Abstract
A semiconductor device according to an embodiment includes a substrate, a plurality of first semiconductor chips, a plurality of first resins, and a second semiconductor chip. The substrate has a first surface. The plurality of first semiconductor chips are stacked while being displaced in a direction substantially parallel to the first surface. The plurality of first resins are provided on respective lower surfaces of the plurality of first semiconductor chips. The second semiconductor chip is provided on the first surface. At least one of the plurality of first resins is in contact with an upper surface of the second semiconductor chip.
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