PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES
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United States of America
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Issued Date -
Dec 19, 2024
app pub date -
Jun 13, 2023
filing date -
Jun 13, 2023
priority date (Note) -
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Abstract
Wireless interconnects in integrated circuit package substrates with glass cores are disclosed. An example apparatus includes a semiconductor die and a substrate including a glass core. The apparatus also includes a pluggable interconnect including a portion of the glass core. The pluggable interconnect includes a transmission line extending along the portion of the glass core.
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