Thermally Enhanced FCBGA Package
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United States of America
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Issued Date -
Dec 19, 2024
app pub date -
Aug 27, 2024
filing date -
Aug 27, 2024
priority date (Note) -
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Abstract
A semiconductor device has a heat spreader with an opening formed through the heat spreader. The heat spreader is disposed over a substrate with a semiconductor die disposed on the substrate in the opening. A thermally conductive material, e.g., adhesive or an elastomer plug, is disposed in the opening between the heat spreader and semiconductor die. A conductive layer is formed over the substrate, heat spreader, and thermally conductive material.
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