MULTI-CORE CHIP, INTEGRATED CIRCUIT APPARATUS, AND BOARD CARD AND MANUFACTURING PROCEDURE METHOD THEREFOR
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United States of America
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Issued Date -
Dec 19, 2024
app pub date -
Sep 29, 2022
filing date -
Sep 29, 2022
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Abstract
The present disclosure relates to a multi-core chip, an integrated circuit device, a board card and a manufacturing method thereof, where the computing device of the present disclosure is included in an integrated circuit device, and the integrated circuit device includes a universal interconnection interface and other processing devices. The computing device interacts with other processing devices to jointly complete computing operations specified by the user. The integrated circuit device also includes a storage device, which is respectively connected to the computing device and other processing devices and is used for storing data of the computing device and other processing devices.
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