ULTRA-THIN, ULTRA-LOW DENSITY FILMS FOR EUV LITHOGRAPHY

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United States of America

APP PUB NO 20240419062A1
SERIAL NO

18816681

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Abstract

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A filtration formed nanostructure pellicle film is disclosed. The filtration formed nanostructure pellicle film includes a plurality of carbon nanofibers that are intersected randomly to form an interconnected network structure in a planar orientation. The interconnected structure allows for a high minimum EUV transmission rate of at least 92%, with a thickness ranging from a lower limit of 3 nm to an upper limit of 100 nm, to allow for effective EUV lithography processing.

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Patent Owner(s)

Patent OwnerAddress
LINTEC OF AMERICA INCTEXAS USA TEXAS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LIMA, Marcio D Richardson, US 39 149
UEDA, Takahiro Frisco, US 87 719

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