METHOD FOR MEASURING SURFACE PARAMETER OF COPPER FOIL, AND METHOD FOR SORTING COPPER FOIL

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United States of America

APP PUB NO 20240418504A1
SERIAL NO

18714993

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Abstract

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A measurement method capable of acquiring, in a simple manner, a surface parameter of copper foil exhibiting high correlation with high frequency characteristics, the method including: (a) acquiring a surface profile of surface-treated copper foil as a reference; (b) setting a cutoff value for an L filter, the cutoff value satisfies: (i) an arithmetical mean height Sa after processing with the L filter, being 0.5 μm or less, and (ii) a percent change of Sdr or α value after processing with the L filter being 80% or less; (c) acquiring a surface profile of surface-treated copper foil as a measurement object; (d) subjecting the acquired surface profile of the copper foil as the measurement object to filter processing; and (e) calculating at least one of surface parameters defined in ISO25178 on the copper foil as the measurement object based on the surface profile after the filter processing.

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Patent Owner(s)

Patent OwnerAddress
MITSUI MINING & SMELTING CO LTDJAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
IWASE, Takeshi Ageo-shi, JP 14 164
KURIHARA, Hiroaki Ageo-shi, JP 26 114

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