MULTI-CIRCUIT HEAT PUMP

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20240418415A1
SERIAL NO

18738111

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A multi-circuit heat pump is disclosed. The heat pump comprises an evaporator, a plurality of condensers fluidically connected in series, and a plurality of compressor units configured between the evaporator and the plurality of condensers such that one of the compressor units is fluidically configured between the evaporator and one of the condensers.

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Patent Owner(s)

Patent OwnerAddress
CARRIER CORPFLA FLORIDA

International Classification(s)

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  • 2024 Application Filing Year
  • F25B Class
  • 513 Applications Filed
  • 30 Patents Issued To-Date
  • 5.85 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Halbe, Chaitanya Liverpool, US 2 0
Sishtla, Vishnu Syracuse, US 17 71

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Patent Citation Ranking

  • 0 Citation Count
  • F25B Class
  • 0 % this patent is cited more than
  • 1 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges12212201 - 1001002003004005006007008009001000110012001300

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