MODIFIED AMINOPLASTIC ADHESIVE RESIN, PROCEDURE OF ITS PREPARATION, AND COMPOSITE MATERIALS PREPARED USING THE MODIFIED AMINOPLASTIC ADHESIVE RESIN
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United States of America
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Issued Date -
Dec 19, 2024
app pub date -
Oct 22, 2021
filing date -
Oct 22, 2021
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Abstract
A temperature-curable aminoplastic adhesive resin that is a (poly)-condensate of: (i) at least one aminoplast-forming chemical; (ii) 5-hydroxymethylfurfural (5-HMF), its oligomers and/or its isomers; and, (iii) at the least one second (poly-)condensable chemical produced in the presence of an organic sulfonic acid. Composite boards, such as wood-based panels, can be produced using this adhesive resin. The production of the aminoplastic adhesive resins includes the reaction of urea with 5-hydroxymethylfurfural (5-HMF) and glyoxal in the presence of an organic sulfonic acid as a hardener. The adhesive resin can be used in the production of wood-based panels, such as, particleboards, chipboards, fiberboards and products usually called, among others, plywood and/or blockboards, in the presence of an organic sulfonic during curing.
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