Method for Producing a Solder Connection and Assembly with a Solder Connection
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United States of America
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Issued Date -
Dec 19, 2024
app pub date -
Oct 4, 2022
filing date -
Oct 4, 2022
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Abstract
Various embodiments of the teachings herein include a method of establishing a solder bond between a first solder partner and a second solder partner with a solder medium including a metallic solder material and a multitude of magnetic nanoparticles. An example method includes: a) generating a magnetic alternating field with a magnet coil acting on the solder medium; b) heating the magnetic nanoparticles via the interaction with the magnetic alternating field; and c) melting the metallic solder material owing to heat transfer from the magnetic nanoparticles to the metallic solder material and thereby forming the solder bond between the first solder partner and the second solder partner with molten metallic solder material.
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