THERMALLY CONDUCTIVE MOUNT

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20240414894A1
SERIAL NO

18696740

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A mount includes a first metal element having a first surface for connection to a heat source, and a second metal element having a second surface for connection to a heat sink. A body made of plastic, glass or ceramic is arranged so as to abut against the first and second metal elements. The body includes through-openings which extend from a region of the first surface to a region of the second surface. The mount includes grooves in the region of the first surface and in the region of the second surface. The grooves extend over two of the through-openings. The first and second metal elements are arranged on the body such that a closed cooling channel is formed by the through-openings, the grooves and the first and second metal elements.

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Patent Owner(s)

Patent OwnerAddress
SIEMENS AKTIENGESELLSCHAFTWERNER-VON-SIEMENS-STRASSE 1 80333 MÜNCHEN 80333

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DANOV, VLADIMIR Erlangen, DE 50 173
MÜLLER, VOLKER Nürnberg, DE 23 27
NEUGEBAUER, STEPHAN Erlangen, DE 17 12
SCHWARZ, FLORIAN Fürth, DE 18 0
STEGMEIER, STEFAN München, DE 24 82

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