INLINE RESISTOR INTEGRATED WITH CONDUCTIVE CONTACT PAD STRUCTURE
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United States of America
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Issued Date -
Dec 12, 2024
app pub date -
Jun 7, 2023
filing date -
Jun 7, 2023
priority date (Note) -
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Abstract
An integrated circuit structure includes (i) a first layer including a first metal, (ii) a second layer above and in contact with the first layer, the second layer including a resistive material, and (iii) a third layer above and in contact with the second layer, the third layer including a second metal. In an example, the resistive material is different from one or both the first metal and the second metal. An interconnect component is above and in contact with the second layer. In an example, the interconnect component is a solder bump or a solder ball. In an example, a resistivity of the resistive material of the second layer is at least 20%, or at least 50% greater than a resistivity of each of the first and third layers. In an example, the resistive material includes a third metal different from the first and second metals and/or a metalloid.
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