SEMICONDUCTOR PACKAGE AND PACKAGE MODULE INCLUDING THE SAME
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United States of America
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Issued Date -
Dec 12, 2024
app pub date -
Apr 1, 2024
filing date -
Apr 1, 2024
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Abstract
Provided is a semiconductor package including a film substrate including a sprocket hole, a semiconductor chip on the film substrate, interconnection lines connected to the semiconductor chip, a dummy pattern between the sprocket hole and the semiconductor chip, and a cutting pattern between the semiconductor chip and the dummy pattern, wherein the cutting pattern is spaced apart from the interconnection lines and the dummy pattern in a first direction.
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