TERMINAL STRUCTURE AND WIRING SUBSTRATE
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
N/A
Issued Date -
Dec 12, 2024
app pub date -
May 31, 2024
filing date -
May 31, 2024
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A terminal structure includes a first wiring layer, an insulation layer covering the first wiring layer, an opening extending through the insulation layer, via wiring formed in the opening, a second wiring layer electrically connected to the via wiring on the insulation layer, a protective metal layer formed on the second wiring layer, a solder layer formed on the protective metal layer, and an intermetallic compound layer formed between the protective metal layer and the solder layer. The protective metal layer includes a projection projecting further outward from a side surface of the second wiring layer. The intermetallic compound layer covers only the upper surface of the protective metal layer. The solder layer covers only an upper surface of the intermetallic compound layer and exposes the side surfaces of the intermetallic compound layer, the protective metal layer, and the second wiring layer.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully