Interlayer of Sub-structure Having Elevations and Further Sub-structure with Filler Particles in Recesses Between the Elevations
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
N/A
Issued Date -
Dec 12, 2024
app pub date -
Aug 20, 2024
filing date -
Aug 20, 2024
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A method includes coupling a first sub-structure with a second sub-structure; configuring the second sub-structure as a composite comprising filler particles in a matrix; configuring a surface of the first sub-structure with a surface profile having first elevations and first recesses; at least partially inserting at least part of the filler particles in the first recesses to form an interlayer comprising the first elevations of the first sub-structure and filler particles in the matrix of the second sub-structure; and forming second elevations and second recesses on the first elevations and the first recesses, wherein the second elevations and the second recesses have smaller dimensions than the first elevations and the first recesses, wherein the second recesses are dimensioned to enable at least part of the matrix to at least partially enter the second recesses and are dimensioned to disable the filler particles to enter the second recesses.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully