ON DIE FLEXURE CONTROL DEVICE AND METHOD
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Dec 12, 2024
app pub date -
Jun 9, 2023
filing date -
Jun 9, 2023
priority date (Note) -
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Abstract
An electronic device and associated methods are disclosed. Electronic devices are shown that include a semiconductor die and a patterned layer connected to a backside of the die. Electronic devices are shown that include a pattern of elements across a patterned layer that varies across the backside of a die. Electronic devices are further shown that include a compliant filler within elements in a patterned layer.
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