PATTERN INSPECTION DEVICE AND PATTERN INSPECTION METHOD

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United States of America

APP PUB NO 20240413024A1
SERIAL NO

18532473

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Abstract

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Provided is a pattern inspection method including obtaining an image of a substrate on which a pattern is formed, extracting a contour based on the image, detecting positions of a target pattern based on the contour, generating pattern inspection data by performing a curve-fitting on the detected positions of the target pattern, and analyzing the pattern based on the pattern inspection data, wherein the curve-fitting is performed by using at least one of a Sigmoid function, a hyperbolic tangent function, and a Fermi-Dirac function, and wherein the pattern inspection data includes a width in a first direction, a height in a second direction, and a pattern slope of the target pattern.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTD129 SAMSUNG-RO YEONGTONG-GU SUWON-SI GYEONGGI-DO 16677 REPUBLIC OF KOREA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KIM, Doyun Suwon-si, KR 13 38
YANG, Jaewon Suwon-si, KR 41 108
YEO, Sangchul Suwon-si, KR 9 3

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges3335716251501 - 1011 - 20020004000600080001000012000140001600018000200002200024000260002800030000320003400036000

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