THERMAL PROCESSING APPARATUS, THERMAL PROCESSING METHOD, AND SUBSTRATE TREATMENT EQUIPMENT
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United States of America
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Issued Date -
Dec 12, 2024
app pub date -
Jun 7, 2024
filing date -
Jun 7, 2024
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Abstract
Proposed are thermal processing apparatus, thermal processing method, and substrate treatment equipment, in which particle generation and damage to a substrate in the cooling process of the substrate can be prevented. The thermal processing apparatus includes a chamber having a processing zone therein, a plurality of chuck pins configured to support a substrate and move up or down individually, a heater configured to provide heat energy to the processing zone, a fluid supply port configured to supply a fluid to the processing zone, a fluid discharge port configured to discharge the fluid remaining in the processing zone to the outside, and a controller configured to control a treatment process of the substrate.
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