RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, POLYMER COMPOUND, AND COMPOUND
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United States of America
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Issued Date -
Dec 12, 2024
app pub date -
Oct 6, 2022
filing date -
Oct 6, 2022
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Abstract
A resist composition which generates an acid upon exposure to light and whose solubility in a developing solution is changed under action of an acid, the resist composition containing a resin component whose solubility in a developing solution is changed under action of an acid, in which the resin component has a constitutional unit derived from a compound represented by General Formula (a0) in which W represents a polymerizable group, Ar represents an aromatic hydrocarbon group, —OH represents a hydroxy group, La0 represents a divalent linking group, Ya0 represents a single bond or a divalent linking group, Ra01 and Ra02 each independently represents a hydrogen atom, a fluorine atom, or a fluorinated alkyl group, n0 represents an integer in a range of 1 to 4, m represents an integer of 1 or more, and Mm+ represents an m-valent organic cation.
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