SUBSTRATE WITH DEPOSITION AND/OR FRICTION REDUCTION COATING
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Dec 12, 2024
app pub date -
Aug 16, 2024
filing date -
Aug 16, 2024
priority date (Note) -
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Abstract
A substrate includes a bonding array with a plurality of bonding locations. A low emissivity layer is deposited on at least one side of the substrate and covers at least some of the bonding locations. The low emissivity layer may be a metal layer which functions as a radiant barrier. The fibers include a melted exterior due to bonding of the fibres at the bonding locations melting the exterior of the fibres.
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