SANDWICH STRUCTURE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE HOUSING
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United States of America
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Issued Date -
Dec 12, 2024
app pub date -
Oct 18, 2022
filing date -
Oct 18, 2022
priority date (Note) -
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Abstract
An object of the present invention is to provide a sandwich structure with excellent lightness and mechanical properties, and a member for electronic device housings. A main object of the present invention is to provide a sandwich structure including: a plate-like fiber-reinforced composite material member (core material) having a portion formed into a shape in which wavy corrugations extend unidirectionally or multidirectionally; and two plate-like fiber-reinforced composite material members (skin materials) that are bonded to the core material at tops or bottoms of the corrugation of the core material, while having interspaces between the member and the rest part of the core material, and are bonded to each other or through a part of the core material without wavy corrugations formed therein at a peripheral part of the corrugation formed in the core material, so as to seal the formed corrugation.
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