TOOL AND PROCESSES FOR PICK-AND-PLACE ASSEMBLY

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20240407148A1
SERIAL NO

18696516

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A system for assembling a group of dies from a source substrate onto a transfer substrate. A high-throughput low-precision system is configured to pick the group of dies from the source substrate and placed onto an intermediate substrate, where the placement of the group of dies onto the intermediate substrate is performed such that the X and/or Y pitch of the placed group of dies matches a corresponding system-in-package (SiP) pitch. Furthermore, a parallel high-precision system is configured to pick and place the group of dies from the intermediate substrate onto the transfer substrate, where the placement of the group of dies onto the transfer substrate is performed at the SiP pitch, where a precision of assembly onto the transfer substrate is sub-500 nm.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
UNIV TEXASTEXAS USA

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ajay, Paras Austin, US 27 36
Anthis, Austin Austin, US 2 0
Sreenivasan, Sidlgata V Austin, US 214 5594

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation