PRINTED CIRCUIT BOARD
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United States of America
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Issued Date -
Dec 5, 2024
app pub date -
Jun 7, 2023
filing date -
Jun 7, 2023
priority date (Note) -
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Abstract
A printed circuit board includes a base film having a main surface, and an electrically conductive pattern disposed on the main surface. The electrically conductive pattern includes an electrically conductive base layer disposed on the main surface directly or indirectly, and a copper electroplating layer disposed on the electrically conductive base layer. The void density, being a value obtained by dividing a sum of areas of voids within a predetermined observation length at an interface between the electrically conductive base layer and the copper electroplating layer by the observation length, is more than 0.01 μm2/μm and 5.5 μm2/μm or less.
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