ACOUSTIC WAVE DEVICES

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20240405744A1
SERIAL NO

18677216

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An acoustic wave device includes a device chip, a first metal pattern formed on one surface of the device chip and including a pattern configured to form a resonator, a second metal pattern formed on the one surface of the device chip so as to have a predetermined thickness larger than the first metal pattern at any position and including a pattern including a signal input/output terminal, a wiring connecting the signal input/output terminal and the resonator, a wiring connecting a plurality of resonators and a ground wiring, a first roof portion made of resin formed on the second metal pattern, a metal layer within the roof formed on the first roof portion, a second roof portion made of resin formed on the first roof portion, two or more heat dissipation solder bumps formed by a heat dissipation passage hole passing through the second roof portion.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
SANAN JAPAN TECHNOLOGY CORPORATION4F-1 IXINAL MONZENNAKACHO 2-5-4 FUKUZUMI KOTO-KU TOKYO 1350032

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KADOGAWA, Yutaka Tokyo, JP 11 56
NAKAMURA, Hiroshi Tokyo, JP 877 11765
SHIOI, Shinichi Tokyo, JP 17 0

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