SEMICONDUCTOR MEMORY SYSTEM
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United States of America
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Dec 5, 2024
app pub date -
Aug 15, 2024
filing date -
Aug 15, 2024
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Abstract
According to one embodiment, a semiconductor memory system includes a substrate, a plurality of elements and an adhesive portion. The substrate has a multilayer structure in which wiring patterns are formed, and has a substantially rectangle shape in a planar view. The elements are provided and arranged along the long-side direction of a surface layer side of the substrate. The adhesive portion is filled in a gap between the elements and in a gap between the elements and the substrate, where surfaces of the elements are exposed.
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