PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARATUS FOR EFFECTING THE SAME
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United States of America
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Dec 5, 2024
app pub date -
Jun 2, 2023
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Jun 2, 2023
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Abstract
A bonded assembly may be formed by providing a wafer comprising at least a first packaging substrate and a second packaging substrate in a low-oxygen ambient; performing a first plasma package-treatment process on the first semiconductor package in the low-oxygen ambient while performing a first substrate-treatment process on the first packaging substrate in a low-oxygen ambient having an oxygen partial pressure that is lower than 17 kPa; and performing a second plasma package-treatment process on the second semiconductor package while performing a second substrate-treatment process on the second packaging substrate and while bonding the first semiconductor package to the first packaging substrate.
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