PATCH INTERPOSER MOLD DESIGN FOR LIQUID METAL CARRIER ARRAY
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United States of America
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Issued Date -
Dec 5, 2024
app pub date -
May 31, 2023
filing date -
May 31, 2023
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Abstract
Embodiments described herein include a liquid metal carrier. In an embodiment, the liquid metal carrier includes a substrate that is a polymer. In an embodiment, a first opening is provided through the substrate with a first shape, and a second opening is provided through the substrate with a second shape. In an embodiment, the first shape is different than the second shape.
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