SOLID-STATE BONDING METHOD FOR THE MANUFACTURE OF SEMICONDUCTOR CHUCKS AND HEATERS
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United States of America
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Issued Date -
Dec 5, 2024
app pub date -
Aug 14, 2024
filing date -
Aug 14, 2024
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Abstract
A layered assembly for use in a controlled atmosphere chamber includes a plurality of substrates and an electrically functioning layer embedded between two adjacent substrates of the plurality of substrates, the electrically functioning layer being a material configured to secure the two adjacent substrates together using a solid-state bonding process. An electrical termination area is integral with the electrically functioning layer, and a peripheral sealing band is embedded between and extends around a periphery of internal faces of the two adjacent substrates, the peripheral sealing band being a material configured to secure and seal the two adjacent substrates together using the solid-state bonding process. Dielectric regions are present between the two adjacent substrates and between edge boundaries of the electrically functioning layer, the dielectric regions being sealed between the two adjacent substrates by the peripheral sealing band.
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