SUBSTRATE CORRECTION DEVICE, SUBSTRATE LAMINATION DEVICE, SUBSTRATE PROCESSING SYSTEM, SUBSTRATE CORRECTION METHOD, SUBSTRATE PROCESSING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
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United States of America
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Issued Date -
Dec 5, 2024
app pub date -
Aug 9, 2024
filing date -
Aug 9, 2024
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Abstract
In a first aspect of the present invention, there is provided a substrate correction device which includes: an acquisition unit which acquires first information based on positional information of a plurality of alignment marks on a substrate, the alignment marks being measured externally; a stage which holds the substrate; a correction unit which corrects a misalignment between the substrate held by the stage, and another substrate to be bonded to the substrate; and a control unit which controls the correction unit based on the first information.
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