SEAM FREE TITANIUM NITRIDE GAPFILL
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United States of America
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Issued Date -
Dec 5, 2024
app pub date -
May 30, 2023
filing date -
May 30, 2023
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Abstract
Embodiments of the disclosure relate to methods of depositing seam-free gapfill. In some embodiments, the gapfill consists of titanium nitride. The gapfill methods comprise forming a first layer and a second layer. The firs layer is formed without treatment or densification, while the second layer is formed with periodic treatment. The resulting gapfill in advantageously seam-free.
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