Inertial Sensor Apparatus
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Dec 5, 2024
app pub date -
May 30, 2024
filing date -
May 30, 2024
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Abstract
An inertial sensor apparatus includes: a base substrate; and a stacked body bonded to the base substrate by a first junction. The stacked body includes: a first inertial sensor that outputs a first detection signal in accordance with an inertial force; a processing circuit that drives the first inertial sensor and that processes the first detection signal; and a second junction that is positioned between the first inertial sensor and the processing circuit and that bonds the first inertial sensor to the processing circuit. A thermal conductivity of the second junction is higher than a thermal conductivity of the first junction.
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