COMPOSITION, COMPOUND, RESIN, SUBSTRATE TREATMENT METHOD, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
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United States of America
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Dec 5, 2024
app pub date -
Aug 12, 2024
filing date -
Aug 12, 2024
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Abstract
The present invention provides a composition for a semiconductor device, where the composition is such that the removability of residues is excellent and the dissolution of tungsten is further suppressed. The composition for a semiconductor device contains a resin having a repeating unit A derived from a polymerizable compound containing a nitrogen atom and water, where a ClogP of the polymerizable compound is 0.5 or more and a solubility of the resin in water at 25° C. is 0.01% by mass or more.
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