CONTACT SUPPORT FOR AN INTEGRATED CIRCUIT
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Nov 28, 2024
app pub date -
Jul 27, 2022
filing date -
Jul 27, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
The invention relates to a contact retention device for an integrated circuit including a common substrate having a hole extending through the common substrate. The contact retention device includes a support part suitable for being fixed to the common substrate and including an orifice suitable for being aligned with the hole, and a retention piece fixed to the support piece and centered by the orifice. The retention part includes an upper part suitable for guiding an insertion of an electrical conductor into the orifice, a lower part suitable for forming an elastic contact between the inserted electrical conductor and the retention part, and a middle part arranged between the upper part and the lower part. The middle part and the lower part are suitable for being inserted into the hole.
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