LIGHT-EMITTING ELEMENT, MANUFACTURING METHOD THEREOF, AND PACKAGE STRUCTURE COMPRISING THE SAME
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
N/A
Issued Date -
Nov 28, 2024
app pub date -
May 20, 2024
filing date -
May 20, 2024
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A light-emitting element, a manufacturing method thereof, and a package structure are provided. The light-emitting element includes a first semiconductor layer, an active layer disposed on the first semiconductor layer, a second semiconductor layer disposed on the active layer, and a convex lens structure disposed on the second semiconductor layer. The convex lens structure includes a plurality of microlenses. The microlenses and the second semiconductor layer are integrally formed and have the same material. The radius of curvature of one of the microlenses is 0.2 μm to 5.0 μm, and the light-emission angle of the light-emitting element is 100° to 110°.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully