IN-SITU MICRO-FLUIDIC CHANNELS FOR HEAT DISSIPATION IN GLASS SUBSTRATE
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United States of America
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Issued Date -
Nov 28, 2024
app pub date -
May 25, 2023
filing date -
May 25, 2023
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Abstract
An electronic device and associated methods are disclosed. In one example, the electronic device includes a glass core layer having a first surface layer and a second surface layer; multiple channels within the glass core layer between the first surface and the second surface layer; and a first redistribution layer (RDL) including multiple sublayers of conductive traces formed in an organic material, wherein a first surface of the RDL contacts the first surface of the glass core layer.
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