TOOL AND PROCESSES FOR PICK-AND-PLACE ASSEMBLY

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20240395578A1
SERIAL NO

18696620

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Abstract

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A system for assembling a first substrate to a second substrate. One or more deformable substrate chucks are utilized to match a topography of a bonding surface on the first substrate to a topography of a bonding surface on the second substrate, where a volatile lubricant is utilized during an alignment step.

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Patent Owner(s)

Patent OwnerAddress
UNIV TEXASTEXAS USA

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ajay, Paras Austin, US 27 36
Anthis, Austin Austin, US 2 0
Sreenivasan, Sidlgata V Austin, US 214 5594

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