WET ETCH APPARATUS

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20240395572A1
SERIAL NO

18791036

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A wet etch apparatus includes a wafer chuck, a dispensing nozzle above the wafer chuck, a rail, first and second vehicles, and an electric field generator. The rail extends at least from a first position aligned laterally with the wafer chuck to a second position higher than a top surface of the wafer chuck. The first and second vehicles are movable along the rail. The electric field generator is operative to generate an electric field across the wafer chuck. The electric field generator comprises a first electrode carried by the first vehicle and a second electrode carried by the second vehicle.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LIAO, Han-Wen Taichung City, TW 21 33
LU, Hong-Ting Taichung City, TW 4 0

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