HEAT DISSIPATION ASSEMBLY AND HEAT DISSIPATER

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20240393053A1
SERIAL NO

18693398

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Abstract

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A heat dissipation assembly and a heat dissipator are disclosed. The heat dissipation assembly may include: a base plate bottom; a base plate cover connected to the base plate bottom and forming a heat collection cavity for concentrating heat; a turbulation component provided in the heat collection cavity, the turbulation component comprising at least one turbulation piece; and a plurality of heat dissipation components connected to the base plate cover, wherein the heat dissipation components are provided with at least one heat dissipation pipeline, the heat dissipation pipeline is provided in communication with the heat collection cavity.

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Patent Owner(s)

Patent OwnerAddress
ZTE CORPORATIONZTE PLAZA KEJI ROAD SOUTH HI-TECH INDUSTRIAL PARK NANSHAN DISTRICT SHENZHEN GUANGDONG PROVINCE 518057

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DUAN, Kaiwen Shenzhen, CN 2 7
LI, Shuai Shenzhen, CN 197 684
LIU, Fan Shenzhen, CN 63 244
LIU, Xin Shenzhen, CN 657 8645
NIE, Zhidong Shenzhen, CN 1 0
WANG, Yan Shenzhen, CN 1171 7294
ZHAO, Mingming Shenzhen, CN 20 53

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