HIGH-FREQUENCY DIELECTRIC HEATING ADHESIVE

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United States of America

APP PUB NO 20240392166A1
SERIAL NO

18696248

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Abstract

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A high-frequency dielectric heating adhesive contains a thermoplastic resin and a cyano group-containing organic compound, and the high-frequency dielectric heating adhesive satisfies (1) below: (1) the high-frequency dielectric heating adhesive has a total luminous transmittance of 50% or more as measured in accordance with JIS K 7361-1:1997.

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Patent Owner(s)

Patent OwnerAddress
LINTEC CORPTOKYO JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MORI, Yuichi Tokyo, JP 76 1312
TAYA, Naoki Tokyo, JP 46 111

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